PlanarFlux™

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The PlanarFlux™ Process is an advanced surface mount assembly technique designed to eliminate solder paste by combining precision-flattened solder pads with a high-tack flux application. Developed to improve process reliability and reduce common defects like tombstoning and voiding, PlanarFlux™ enables consistent component seating and strong solder joints by leveraging the existing HASL finish. Components are placed directly onto the tacky flux-coated pads and reflowed, forming robust metallurgical bonds without the variability of paste printing. Ideal for high-mix, prototype, and low-volume production, the PlanarFlux™ Process streamlines assembly while enhancing precision and repeatability.